<?xml version='1.0' encoding='UTF-8'?><KD_8_1_Z2 version="1" xmlns="http://www.brz.gv.at/eproc/kd/2018/12"><CONTRACTING_BODY><ADDRESS_CONTRACTING_BODY><OFFICIALNAME>Silicon Austria Labs GmbH</OFFICIALNAME><NATIONALID>9110023950495</NATIONALID><PHONE>+43 14097609</PHONE><E_MAIL>kanzlei@schramm-oehler.at</E_MAIL><CONTACT>Schramm &#214;hler Rechtsanw&#228;lte GmbH, zH RA Mag. David Melingo und RA Mag. Christian Gruber, Bartensteingasse 2, 1010 Wien</CONTACT></ADDRESS_CONTRACTING_BODY><DOCUMENT_FULL/><URL_DOCUMENT>https://steiermark.vergabeportal.at/Detail/222957</URL_DOCUMENT><URL_PARTICIPATION>https://steiermark.vergabeportal.at/Detail/222957</URL_PARTICIPATION></CONTRACTING_BODY><OBJECT_CONTRACT><TITLE><P>Silicon Austria Labs – Chips JU: Wafer bumper</P></TITLE> <REFERENCE_NUMBER>1</REFERENCE_NUMBER><CPV_MAIN><CPV_CODE CODE="38000000" /></CPV_MAIN><TYPE_CONTRACT CTYPE="SUPPLIES" /><SHORT_DESCR><P>The aim of this procurement procedure is to award the contract to the best bidder identified during the procurement procedure for the supply, installation and commissioning of an automated wafer soldering bumping tool as well as services such as trainings for Silicon Austria Labs GmbH.</P></SHORT_DESCR><NO_LOT_DIVISION /><OBJECT_DESCR><NUTS CODE="AT211" /><MAIN_SITE><P>Cleanroom</P></MAIN_SITE><DURATION TYPE="MONTH">11</DURATION></OBJECT_DESCR></OBJECT_CONTRACT><LEFTI></LEFTI><PROCEDURE><PT_COMPETITIVE_NEGOTIATION /><DATETIME_RECEIPT_TENDERS>2025-09-30T12:00:00</DATETIME_RECEIPT_TENDERS></PROCEDURE><COMPLEMENTARY_INFO><DATE_DISPATCH_NOTICE>2025-08-28</DATE_DISPATCH_NOTICE></COMPLEMENTARY_INFO><ADDITIONAL_CORE_DATA><DATE_FIRST_PUBLICATION>2025-08-30</DATE_FIRST_PUBLICATION><DATETIME_LAST_CHANGE>2025-08-30T19:05:00</DATETIME_LAST_CHANGE></ADDITIONAL_CORE_DATA></KD_8_1_Z2>